AI Chips & Infrastructure

Samsung and AMD Partner on HBM4 AI Memory

New MOU targets HBM4 for AMD Instinct MI455X GPUs and advanced DRAM for EPYC processors.

By Kronos News Desk··1 min read
A close-up of a semiconductor wafer with intricate light reflections, symbolizing advanced HBM4 memory and AI chip technology.

A close-up of a semiconductor wafer with intricate light reflections, symbolizing advanced HBM4 memory and AI chip technology.

Photo: Kronos News

Samsung and AMD signed a Memorandum of Understanding to collaborate on next-generation AI memory solutions [1]. The partnership focuses on supplying HBM4 chips for AMD future AI accelerators, including the upcoming Instinct MI455X GPU [1][3]. This move aims to secure high-performance components for the rapidly growing generative AI market [2]. Beyond high-bandwidth memory, the agreement includes the development of advanced DRAM for AMD EPYC server processors [1]. These technologies are critical for high-performance computing and data center efficiency [2][3]. Samsung is positioning itself as a primary supplier to compete in the high-stakes AI hardware sector [2]. This expansion strengthens the technical ties between the two semiconductor giants as they scale production [1]. The collaboration highlights the increasing demand for specialized memory capable of handling massive AI workloads [2][3]. Details regarding specific production volumes were not disclosed in the official announcement.

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Kronos News Desk covers ai chips & infrastructure and editorial analysis for Kronos News.